Surface Engineering, Vol. 38, No. 6, ready to read
Anti-fingerprint applications, packaging applications and surface modification all feature in this issue.

This issue contains the following articles, which are available to members via My IOM3.
Surface engineering for anti-fingerprint applications
Lakshmi Gopal & Tirumalai Sudarshan
Pages: 571-575
DOI: 10.1080/02670844.2022.2131043
A critical review of copper electroless deposition on glass substrates for microsystems packaging applications
Karan Pawar & Pradeep Dixit
Pages: 576-617
DOI: 10.1080/02670844.2022.2142002
Acrylic-based monocoat eco-friendly, anticorrosive coating for cathodic electrodeposition
Shiv Charan Prajapati & Pramod Kumar Kamani
Pages: 618-632
DOI: 10.1080/02670844.2022.2148496
Electrodeposition of Pd–Ag alloy for electrical contacts
Yen Ngoc Nguyen, Jisun Yoon, Jiyeon Shin & Injoon Son
Pages: 633-640
DOI: 10.1080/02670844.2022.2151335
Surface amorphization of Mg-Zn-Ca alloy by laser rapid melting for orthopaedic applications
Chunming Wang, Liuyimei Yang, Shuping Peng & Cijun Shuai
Pages: 641-650
DOI: 10.1080/02670844.2022.2148503
Enhancing the hydrophobicity of Ti–6Al–4V through multi-level electrical discharge texturing
Mahavir Singh, Pragya Tripathi & Janakarajan Ramkumar
Pages: 651-663
DOI: 10.1080/02670844.2022.2143674
Surface modification in the shape of a pattern using crepe paper maskant in EDM
Rashed Mustafa Mazarbhuiya, Maneswar Rahang & Subhankar Saha
Pages: 664-674
DOI: 10.1080/02670844.2022.2148452