Surface Engineering, Vol. 38, No. 6, ready to read

Anti-fingerprint applications, packaging applications and surface modification all feature in this issue.

This issue contains the following articles, which are available to members via My IOM3.

Surface engineering for anti-fingerprint applications

Lakshmi Gopal & Tirumalai Sudarshan

Pages: 571-575

DOI: 10.1080/02670844.2022.2131043

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

Karan Pawar & Pradeep Dixit

Pages: 576-617

DOI: 10.1080/02670844.2022.2142002

Acrylic-based monocoat eco-friendly, anticorrosive coating for cathodic electrodeposition

Shiv Charan Prajapati & Pramod Kumar Kamani

Pages: 618-632

DOI: 10.1080/02670844.2022.2148496

Electrodeposition of Pd–Ag alloy for electrical contacts

Yen Ngoc Nguyen, Jisun Yoon, Jiyeon Shin & Injoon Son

Pages: 633-640

DOI: 10.1080/02670844.2022.2151335

Surface amorphization of Mg-Zn-Ca alloy by laser rapid melting for orthopaedic applications

Chunming Wang, Liuyimei Yang, Shuping Peng & Cijun Shuai

Pages: 641-650

DOI: 10.1080/02670844.2022.2148503

Enhancing the hydrophobicity of Ti–6Al–4V through multi-level electrical discharge texturing

Mahavir Singh, Pragya Tripathi & Janakarajan Ramkumar

Pages: 651-663

DOI: 10.1080/02670844.2022.2143674

Surface modification in the shape of a pattern using crepe paper maskant in EDM

Rashed Mustafa Mazarbhuiya, Maneswar Rahang & Subhankar Saha

Pages: 664-674

DOI: 10.1080/02670844.2022.2148452