News

A printed electronic substrate

Low-cost printing of electronics

Packaging Professional magazine
A UK printed media firm claims to have developed a low-cost way of applying electronic circuitry to packaging, which could turn an ordinary carton into an interactive game. The technique uses existing high-volume printing processes, such as screen, offset and flexography, to pattern metallic conductive tracks onto substrates.

Guests travel from afar to attend awards dinner

IOM3
On 22 October new Fellows, special and publication award winners and their guests gathered for the Institute's Special and Publications Awards dinner.

Report of ICCM-17 conference

The British Composites Society
A report of the ICCM-17 conference, held in Edinburgh from 27-31 July 2009.

New surface engineering award for 2010

IOM3
A new Institute award for 2010, the Tom Bell Award, recognises excellence in surface engineering.

Resource mapping of packaging and food waste

IOM3
Packaging experts are being asked to provide accurate and up-to-date information about waste produced across all parts of the supply chain.

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