Artificially nanoengineered pinning centres have been introduced to high temperature superconducting (HTS) thin films to increase their critical current density by up to three times that of the standard 1.5 Tesla.
A UK printed media firm claims to have developed a low-cost way of applying electronic
circuitry to packaging, which could turn an ordinary carton into an interactive game.
The technique uses existing high-volume printing processes, such as screen, offset and
flexography, to pattern metallic conductive tracks onto substrates.
Computer models that simulate silicon chip production are helping manufacturers develop next generation transistors at 32 and 22nm nodes and beyond.The simulations look at flash annealing of doped silicon, as well as new materials, such as silicon-germanium alloys, and novel structures, such as strained silicon.
Nano-enabled coatings have been widely championed over the last decade, but, to-date, applications commercialised successfully have been small volume, high added value products. Delegates at the Nano-enabled Coatings event, held on 23 September in London, UK, believe the time has arrived for the breakthrough into large volume, mass applications.
UK researchers are exploring a new analytical framework for predicting and measuring weld induced residual stresses. This could have important implications for nuclear and aerospace applications by providing a more accurate, rapid and less costly approach to the problem using 3D eigenstrain solutions.
A novel computational approach could improve understanding of how fluids interact with solid structures such as turbine blades or aeroplanes. This would help engineers eliminate catastrophic mechanical failure caused by unstable contact.