Scientists at the Fraunhofer Institute in Bremen, Germany, are developing a manufacturing technique to integrate electric sensors, actuators and components into light metals while they are being cast. This would create ‘intelligent’ parts that could monitor components’ stability or track their movements.
Using silicon rather than sapphire wafers could bring down the cost of light emitting diodes and transform solid state lighting in homes and offices. Researchers at Purdue University, West Lafayette, USA, claim to have overcome the difficulty in metallising silicon with a reflective layer.
Researchers working on CONTACT, a four-year EU-funded project, have developed a method of printing precise layers of water-based or pigmented inks onto a substrate material, such as glass or metal foil, for printed electronics.