Globalisation

Globalisation of markets and growth. Growth opportunities in downstream product developments. Supply chain logistics.   

Mechanism for improved links between systems and component manufacturers.
Increased capital investment and technical innovation in R&D

Regulation and Standards

Environmental issues: · Reduction of process emissions.
· Design for use, re-use, dismantling and recycling.
· Energy efficiency.
Legislation: may outlaw current materials in products (e.g. lead-based piezoelectrics) and in production (e.g. solvents).

National and international standards.

Sensors and modelling, improved abatement techniques. Energy-efficient processes. Waste recycling technologies.

Dissemination of good practise. Dissemination of information on current and impending legislation. Dissemination of new standards, good practice guides.

Education and Training

Recruitment and retention of well-qualified staff at all levels is difficult.

The need for a more structured undergraduate curriculum with industrial relevance

Image of manufacturing industry.

Career development, continuous training, competitive remuneration.

Collaboration between industry/higher education and local education establishments.

National initiative to involve industry in motivating education in science and technology at all levels.

Business practice and economics

Productivity pressures.
Time to market. Corporate consolidation. Distributed manufacturing.

Development of existing sectors: Automotive, Communications, Consumer electronics etc.

Drive for reduced component size, increased performance, reduced cost in all sectors.
Capacitors: thinner layers, base-metal electrodes for co-fired components. Varistors/thermistors: extended temperature ranges, increased voltage shock performance, form factor changes.
Sensors (physical and first-generation chemical): improved performance, cost-reduction, reliability, and packaging. Microwave dielectrics: tunable filters and antennae, ceramic packaging. Piezoelectrics: strong growth for actuators in automotive, aerospace and communications; single crystals; lead-free piezoelectrics. Thick film technology (hybrid circuits): slow take up of multilayer technology (LTCC).

Better understanding of current materials and processes. Materials integration: fabrication methods, materials compatibility.

Modelling: advanced ab inition methods, multi-scale structure-property relationships, multi-scale process modelling.  Technology transfer, academic-industrial collaboration.

Formation of an industry-led 'Electroceramics Forum': to promote a shared approach to common problems and to coordinate and support longer-term academic research.

Emerging Materials and Technologies.

Identification of new opportunities: Medical applications.
Fuel cell technologies,
Single crystal piezoelectrics, Micro-engineering with ceramics,
Thin films / integrated components, High resolution thick film ceramics,
Low temperature co-fired ceramic (LTCC) technology, Ceramic packaging for microwave and wireless technologies.

Encouragement of  R&D in emerging areas. Technology transfer, academic-industrial collaboration. 'Electroceramics Forum' (as above)